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This is the free Material Data Center Datasheet of CELANEX® 2004-2 - PBT - Celanese

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Product Texts
Celanex 2004-2 is an unfilled polyester that has an excellent combination of flowability and toughness. A typical application for Celanex 2004-2 is electrical connectors containing latches. Celanex 2004-2 contains an internal lubricant.

Flammability at thickness h (1 mm)HB-
Processing/Physical CharacteristicsValueUnitTest Standard
ISO Data
Melt volume-flow rate, MVR 33 cm³/10min ISO 1133
Temperature 250 °C -
Load 2.16 kg -
Molding shrinkage, parallel 1.9 % ISO 294-4, 2577
Molding shrinkage, normal 1.8 % ISO 294-4, 2577
Mechanical propertiesValueUnitTest Standard
ISO Data
Tensile Modulus 2400 MPa ISO 527
Yield stress 54 MPa ISO 527
Yield strain 8 % ISO 527
Nominal strain at break 37 % ISO 527
Charpy impact strength, +23°C 218 kJ/m² ISO 179/1eU
Charpy impact strength, -30°C 45 kJ/m² ISO 179/1eU
Charpy notched impact strength, +23°C 4.5 kJ/m² ISO 179/1eA
Charpy notched impact strength, -30°C 4.5 kJ/m² ISO 179/1eA
Shore D hardness 81 - ISO 7619-1
Thermal propertiesValueUnitTest Standard
ISO Data
Melting temperature, 10°C/min 225 °C ISO 11357-1/-3
Glass transition temperature, 10°C/min 60 °C ISO 11357-1/-2
Temp. of deflection under load, 1.80 MPa 54 °C ISO 75-1/-2
Temp. of deflection under load, 0.45 MPa 166 °C ISO 75-1/-2
Vicat softening temperature, B 175 °C ISO 306
Coeff. of linear therm. expansion, parallel 110 E-6/K ISO 11359-1/-2
Burning Behav. at thickness h HB class IEC 60695-11-10
Thickness tested 1.0 mm -
Electrical propertiesValueUnitTest Standard
ISO Data
Relative permittivity, 100Hz 3.7 - IEC 62631-2-1
Relative permittivity, 1MHz 3.5 - IEC 62631-2-1
Dissipation factor, 100Hz 30 E-4 IEC 62631-2-1
Dissipation factor, 1MHz 210 E-4 IEC 62631-2-1
Volume resistivity >1E13 Ohm*m IEC 62631-3-1
Surface resistivity >1E15 Ohm IEC 62631-3-2
Other propertiesValueUnitTest Standard
Water absorption 0.45 % Sim. to ISO 62
Density 1300 kg/m³ ISO 1183
Processing Recommendation Injection MoldingValueUnitTest Standard
Pre-drying - Temperature 121 °C -
Pre-drying - Time 4 h -
Processing humidity ≤0.02 % -
Melt temperature 235 - 260 °C -
Mold temperature 65 - 93 °C -
Diagrams
Stress-strain , CELANEX® 2004-2, PBT, Celanese
Secant modulus-strain , CELANEX® 2004-2, PBT, Celanese
Characteristics
Processing
Injection Molding
Delivery form
Pellets
Additives
Lubricants
Applications
Electrical and Electronical
Regional Availability
North America, Europe, Asia Pacific, South and Central America, Near East/Africa
Other text information
Injection molding
To avoid hydrolytic degradation during processing, CELANEX resins have to be dried to a moisture level equal to or less than 0.02%. Drying should be done in a dehumidifying hopper dryer capable of dewpoints <-30°F (-34°C) at 250°F (121°C) for 4 hours.
Rear Temperature 450-470(230-240) deg F (deg C)
Center Temperature 460-480(235-250) deg F (deg C)
Front Temperature 470-500(240-260) deg F (deg C)
Nozzle Temperature 480-500(250-260) deg F (deg C)
Melt Temperature 460-500(235-260) deg F (deg C)
Mold Temperature 150-200(65-93) deg F (deg C)
Back Pressure 0-50 psi
Screw Speed Medium
Injection Speed Fast

Injection speed, injection pressure and holding pressure have to be optimized to the individual article geometry. To avoid material degradation during processing low back pressure and minimum screw speed have to be used. Overheating of the material has to be avoided, in particular for flame retardant grades. Up to 25% clean and dry regrind may be used.
Disclaimer
Copyright Altair Engineering GmbH. Altair Engineering GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from Altair Engineering GmbH; this is especially valid for claims of compensation resulting from consequential damages. Altair explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.
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