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This is the free Material Data Center Datasheet of Platamid® H 2707 Pellets - PA* - ARKEMA

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Product Texts
Platamid® H 2707 Pellets
Copolyamide Hot Melt Adhesive / Extrusion Applications

Platamid® H 2707 is a standard thermoplastic copolyamide hot melt adhesive available in pellet form. This medium to high melt viscosity grade is particularly suitable for manufacturing webs, mono- and multi-filaments, and films by extrusion.


Platamid® H 2707 offers a good adhesion at low fusing conditions to various polar substrates (thermoplastics, thermosets, metal, natural fibers, etc.).


According to ASTM D6866, the biobased carbon content is measured at 20%.



AVAILABLE GRADES
This grade is available:
- dried (H 2707 T)
PACKAGING
- Platamid® H 2707 T is delivered in 25 kg sealed bags.
SHELF LIFE
Two years from the date of delivery. For any use above this limit, please refer to our technical services.
RENEWABLE CARBON CONTENT
20% (according ASTM D6866)
Processing/Physical Characteristicsdry / condUnitTest Standard
ISO Data
Melt volume-flow rate, MVR 2 / * cm³/10min ISO 1133
Temperature 160 / * °C -
Load 2.16 / * kg -
Thermal propertiesdry / condUnitTest Standard
ISO Data
Melting temperature, 10°C/min 102 / * °C ISO 11357-1/-3
Other propertiesdry / condUnitTest Standard
Density 1060 / 1060 kg/m³ ISO 1183
Biobased content 20 % -
Characteristics
Processing
Film Extrusion
Delivery form
Pellets
Features
Good Adhesion, Copolymer
Certifications
Contains renewable resources
Applications
Monofilament, Multifilament
Regional Availability
Disclaimer
Copyright Altair Engineering GmbH. Altair Engineering GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from Altair Engineering GmbH; this is especially valid for claims of compensation resulting from consequential damages. Altair explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.
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