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This is the free Material Data Center Datasheet of Platamid® M 995 Pellets - PA* - ARKEMA

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Product Texts
Platamid® M 995 Pellets

Copolyamide Hot Melt Adhesive /Extrusion Applications

 

Platamid® M 995 Pellets is a standard thermoplastic copolyamide hot melt adhesive available in pellet form. This high melt viscosity grade is particularly suitable for manufacturing of films and masterbatches.

Platamid® M 995 Pellets offer very good adhesion to various polar substrates (thermoplastics, thermosets, metal, natural fibers, etc).



AVAILABLE GRADES

This grade is available:

- dried (M 995 T)

- undried (M 995 F)

PACKAGING

Platamid® M 995 T and  Platamid® M 995 F are delivered in 25 kg sealed bags.

These grades are ready to be processed

SHELFLIFE

Two years from the date of delivery. For any use above this limit, please refer to our technical services.

Processing/Physical Characteristicsdry / condUnitTest Standard
ISO Data
Melt volume-flow rate, MVR 2 / * cm³/10min ISO 1133
Temperature 160 / * °C -
Load 2.16 / * kg -
Thermal propertiesdry / condUnitTest Standard
ISO Data
Melting temperature, 10°C/min 144 / * °C ISO 11357-1/-3
Characteristics
Processing
Film Extrusion
Delivery form
Pellets
Features
Good Adhesion, Copolymer
Regional Availability
North America, Europe, Asia Pacific, South and Central America, Near East/Africa
Disclaimer
Copyright Altair Engineering GmbH. Altair Engineering GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from Altair Engineering GmbH; this is especially valid for claims of compensation resulting from consequential damages. Altair explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.
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