Complete Set of CAMPUS® Data, ASTM Data, Biopolymer Database, Application Database, Tradename Database, Literature Database, Toolbox.

Material datasheets available free. Online registration at: www.materialdatacenter.com

Material Data Center is a leading international information system for the plastics industry. Material Data Center offers a comprehensive plastics database, calculation tools, CAE interfaces, a literature database and an application database. For more information about Material Data Center visit www.materialdatacenter.com.

This is the free Material Data Center Datasheet of VESTAMID® L1670 - PA12 - Evonik Operations GmbH

Material Data Center offers the following functions for VESTAMID® L1670:
unit conversion, PDF datasheet print, comparison with other plastics, snap fit calculation, beam deflection calculation, CAE Interfaces

Check here, which other Vestamid datasheets, application examples or technical articles are available in Material Data Center

Use the following short links to get directly to the properties of interest in this datasheet:
Any use of this information falls under the rules of our disclaimer.
Product Texts

Low viscosity, heat and light stabilized Polyamide 12 compound

VESTAMID® L1670 has been developed especially for the extrusion of thin wire insulations and cable jacketings.

VESTAMID® L1670 coatings exhibit a low coefficient of friction which facilitates the laying of cable.

Switchboard wiring isolated with VESTAMID® L1670 can be soldered with no worry of interference by the plastic resin. The wiring can be soldered without the need to strip the isolating layer.

Jacketing of VESTAMID® L1670 protects buried cables from attack by termites.

This partially crystalline polyamide 12 bases compounds have a very low water absorption. Therefore products produced from VESTAMID® L1670 maintain their dimensions in environments with varying humidity levels, while maintaining a high tenacity, a low coefficient of friction and good chemical resistance. VESTAMID® L1670 is supplied as cylindrical granules, ready for processing in moisture-proof packaging.

Pigmentation may affect values.

Inside the original and undamaged packaging, the product has a shelf life of at least 2 years when stored in dry rooms at temperatures not exceeding 30°C.

For information about processing of VESTAMID®, please follow the general commendations about “Processing of VESTAMID® compounds”. 

FOR FURTHER INFORMATION PLEASE CONTACT US AT EVONIK-HP@EVONIK.COM
OR VISIT OUR PRODUCT AT  WWW.VESTAMID.COM

Processing/Physical Characteristicsdry / condUnitTest Standard
ISO Data
Melt volume-flow rate, MVR 60 / * cm³/10min ISO 1133
Temperature 230 / * °C -
Load 2.16 / * kg -
Molding shrinkage, parallel 0.9 / * % ISO 294-4, 2577
Molding shrinkage, normal 1.1 / * % ISO 294-4, 2577
Mechanical propertiesdry / condUnitTest Standard
ISO Data
Tensile Modulus 1400 / 1090 MPa ISO 527
Yield stress 44 / 40 MPa ISO 527
Yield strain 5 / 13 % ISO 527
Nominal strain at break >50 / >50 % ISO 527
Charpy impact strength, +23°C N / N kJ/m² ISO 179/1eU
Charpy impact strength, -30°C N / N kJ/m² ISO 179/1eU
Charpy notched impact strength, +23°C 4 / 4 kJ/m² ISO 179/1eA
Type of failure C / C - -
Charpy notched impact strength, -30°C 5 / 4 kJ/m² ISO 179/1eA
Type of failure C / C - -
Shore D hardness 75 / * - ISO 7619-1
Thermal propertiesdry / condUnitTest Standard
ISO Data
Melting temperature, 10°C/min 178 / * °C ISO 11357-1/-3
Glass transition temperature, 10°C/min 45 / * °C ISO 11357-1/-2
Temp. of deflection under load, 1.80 MPa 50 / * °C ISO 75-1/-2
Temp. of deflection under load, 0.45 MPa 120 / * °C ISO 75-1/-2
Vicat softening temperature, B 140 / * °C ISO 306
Coeff. of linear therm. expansion, parallel 150 / * E-6/K ISO 11359-1/-2
Coeff. of linear therm. expansion, normal 150 / * E-6/K ISO 11359-1/-2
Burning Behav. at 1.5 mm nom. thickn. HB / * class IEC 60695-11-10
Thickness tested 1.6 / * mm -
Electrical propertiesdry / condUnitTest Standard
ISO Data
Relative permittivity, 100Hz 3.8 / - - IEC 62631-2-1
Relative permittivity, 1MHz 3 / - - IEC 62631-2-1
Dissipation factor, 1MHz 271 / - E-4 IEC 62631-2-1
Volume resistivity >1E13 / 3.2E12 Ohm*m IEC 62631-3-1
Electric strength - / 33 kV/mm IEC 60243-1
Comparative tracking index 600 / - - IEC 60112
Other propertiesdry / condUnitTest Standard
Water absorption 1.4 / * % Sim. to ISO 62
Humidity absorption 0.7 / * % Sim. to ISO 62
Density 1010 / - kg/m³ ISO 1183
Characteristics
Processing
Injection Molding, Profile Extrusion, Wire/Cable Extrusion, Other Extrusion, Coating
Delivery form
Pellets
Additives
Lubricants
Special Characteristics
Light stabilized or stable to light, U.V. stabilized or stable to weather, Heat stabilized or stable to heat
Features
Tribologic Grade
Chemical Resistance
General Chemical Resistance
Regional Availability
Disclaimer
Copyright Altair Engineering GmbH. Altair Engineering GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from Altair Engineering GmbH; this is especially valid for claims of compensation resulting from consequential damages. Altair explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.
Created: Source: www.materialdatacenter.com


Material Data Center is provided by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

Additional information about this material, like producer contact address, etc. can be found at www.materialdatacenter.com. For access to this extra information a registration is requested. Free online registration is available.