Complete Set of CAMPUS® Data, ASTM Data, Biopolymer Database, Application Database, Tradename Database, Literature Database, Toolbox.

Material datasheets available free. Online registration at: www.materialdatacenter.com

Material Data Center is a leading international information system for the plastics industry. Material Data Center offers a comprehensive plastics database, calculation tools, CAE interfaces, a literature database and an application database. For more information about Material Data Center visit www.materialdatacenter.com.

This is the free Material Data Center Datasheet of CELCON® M25UV - POM - Celanese

Material Data Center offers the following functions for CELCON® M25UV:
unit conversion, PDF datasheet print, comparison with other plastics, snap fit calculation, beam deflection calculation, CAE Interfaces

Check here, which other Celcon datasheets, application examples or technical articles are available in Material Data Center

Use the following short links to get directly to the properties of interest in this datasheet:
Any use of this information falls under the rules of our disclaimer.
Processing/Physical CharacteristicsValueUnitTest Standard
ISO Data
Melt volume-flow rate, MVR 2.2 cm³/10min ISO 1133
Temperature 190 °C -
Load 2.16 kg -
Molding shrinkage, parallel 2.2 % ISO 294-4, 2577
Molding shrinkage, normal 1.8 % ISO 294-4, 2577
Mechanical propertiesValueUnitTest Standard
ISO Data
Tensile Modulus 2500 MPa ISO 527
Yield stress 62 MPa ISO 527
Yield strain 12 % ISO 527
Charpy notched impact strength, +23°C 8.5 kJ/m² ISO 179/1eA
Thermal propertiesValueUnitTest Standard
ISO Data
Melting temperature, 10°C/min 166 °C ISO 11357-1/-3
Temp. of deflection under load, 1.80 MPa 93 °C ISO 75-1/-2
Coeff. of linear therm. expansion, parallel 120 E-6/K ISO 11359-1/-2
Coeff. of linear therm. expansion, normal 120 E-6/K ISO 11359-1/-2
Other propertiesValueUnitTest Standard
Water absorption 0.75 % Sim. to ISO 62
Humidity absorption 0.2 % Sim. to ISO 62
Density 1410 kg/m³ ISO 1183
Processing Recommendation Injection MoldingValueUnitTest Standard
Pre-drying - Temperature 80 °C -
Pre-drying - Time 3 h -
Processing humidity ≤0.35 % -
Melt temperature 182 - 199 °C -
Mold temperature 82 - 93 °C -
Characteristics
Processing
Injection Molding
Delivery form
Pellets
Special Characteristics
U.V. stabilized or stable to weather
Features
Copolymer
Regional Availability
North America, South and Central America
Other text information
Injection molding
Drying is generally not required because Celcon® and Hostaform® acetal copolymers are not hydroscopic nor are they degraded by moisture during processing. Excessive moisture can lead to splay (silver streaking) in molded parts. For better uniformity in molding especially when using regrind or material that has been stored in containers open to the atmosphere, recommended drying conditions are 80 C (180 F) for 3hours. Desiccant hopper dryers are not required. Maximum water content = 0.35%
Standard reciprocating screw injection molding machines with a high compression screw (minimum 3:1 and preferably 4:1) and low back pressure (0.35 Mpa/50 PSI) are favored. Using a low compression screw (I.E. general purpose 2:1 compression ratio) can result in unmelted particles and poor melt homogeneity. Using a high back pressure to make up for a low compression ratio may lead to excessive shear heating and deterioration of the material.

Melt Temperature: Preferred range 182-199 C (360-390 F). Melt temperature should never exceed 230 C (450 F).

Mold Surface Temperature: Preferred range 82-93 C (180-200 F) especially with wall thickness less than 1.5 mm (0.060 in.). May require mold temperature as high as 120 C (250 F) to reproduce mold surface or to assure minimal molded in stress. Wall thickness greater than 3mm (1/8 in.) may use a cooler (65 C/150 F) mold surface temperature and wall thickness over 6mm (1/4 in.) may use a cold mold surface down to 25 C (80 F). In general, mold surface temperatures lower than 82 C (180 F) may hinder weld line formation and produce a hazy surface or a surface with flow lines, pits and other included defects that can hinder part performance.
Postprocessing conditioning and moisturizing are not required. It may be necessary to fixture large or complicated parts with varying wall thickness to prevent warpage while cooling to ambient temperature.
Disclaimer
Copyright Altair Engineering GmbH. Altair Engineering GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from Altair Engineering GmbH; this is especially valid for claims of compensation resulting from consequential damages. Altair explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.
Created: Source: www.materialdatacenter.com


Material Data Center is provided by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

Additional information about this material, like producer contact address, etc. can be found at www.materialdatacenter.com. For access to this extra information a registration is requested. Free online registration is available.