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This is the free Material Data Center Datasheet of Bormed™ HD800CF-11 - PP - Borealis A/S

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Caracteristicas de procesamiento y fisicas - Propiedades mecánicas - Propiedades térmicas - Propiedades opticas - Propiedades mecánicas (Film)
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Caracteristicas de procesamiento y fisicasValorUnidadesMétodo de ensayo
ISO Data
Índice de fluidez, MFI 8 g/10min ISO 1133
Temperatura 230 °C -
Carga 2.16 kg -
Propiedades mecánicasValorUnidadesMétodo de ensayo
ISO Data
Módulo de flexión, 23°C 1400 MPa ISO 178
Propiedades térmicasValorUnidadesMétodo de ensayo
ISO Data
Temperatura de fusión, 10°C/min 164 °C ISO 11357-1/-3
Propiedades opticasValorUnidadesMétodo de ensayo
ASTM Data
Brillo 110 - ASTM D 2457
Opacidad 2 % ASTM D 1003
Propiedades mecánicas (Film)ValorUnidadesMétodo de ensayo
ISO Data
Módulo de tracción, paralelo 800 MPa ISO 527-3
Módulo de tracción, normal 800 MPa ISO 527-3
Alargamiento máximo, paralelo 600 % ISO 527-3
Alargamiento máximo, normal 650 % ISO 527-3
Coeficiente dinámico de fricción 0.7 - ISO 8295
Tipo de extrusión soplado - -
Espesor de la muestra 0.05 mm -
Características
Procesamiento y forma de entrega
Moldeo por inyección, Extrusión de película soplada, Extrusion del film
Características
Propiedades de barrera, High Gloss, Homopolímero
Certifications
Grado médico, Device Master File
Applicaciones
Médico, Empacado
Disponibilidad regional
Norteamérica, Europa, Asia Pacifico, América del Sur y Centroaméric, Próximo Oriente/Africa
Disclaimer
Copyright Altair Engineering GmbH. Altair Engineering GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from Altair Engineering GmbH; this is especially valid for claims of compensation resulting from consequential damages. Altair explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.
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