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This is the free Material Data Center Datasheet of CELCON® M25UV - POM - Celanese

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Caracteristicas de procesamiento y fisicasValorUnidadesMétodo de ensayo
ISO Data
Indice de fluidez volumétrico, MVR 2.2 cm³/10min ISO 1133
Temperatura 190 °C -
Carga 2.16 kg -
Contracción posterior al moldeo, paralelo 2.2 % ISO 294-4, 2577
Contracción posterior al moldeo, normal 1.8 % ISO 294-4, 2577
Propiedades mecánicasValorUnidadesMétodo de ensayo
ISO Data
Módulo de tracción 2500 MPa ISO 527
Esfuerzo de fluencia 62 MPa ISO 527
Alarg. en límite elástico 12 % ISO 527
Resistencia al impacto Charpy c/entalla, +23°C 8.5 kJ/m² ISO 179/1eA
Propiedades térmicasValorUnidadesMétodo de ensayo
ISO Data
Temperatura de fusión, 10°C/min 166 °C ISO 11357-1/-3
Estabilidad al calor, 1.80 MPa 93 °C ISO 75-1/-2
Coef.de expansión térmica lineal, paralelo 120 E-6/K ISO 11359-1/-2
Coef.de expansión térmica lineal, normal 120 E-6/K ISO 11359-1/-2
Otras propiedadesValorUnidadesMétodo de ensayo
Absorción de agua 0.75 % Sim. to ISO 62
Absorción de humedad 0.2 % Sim. to ISO 62
Densidad 1410 kg/m³ ISO 1183
Recomendación para procesamiento Moldeo por inyecciónValorUnidadesMétodo de ensayo
Temperatura de pre-secado 80 °C -
Tiempo de pre-secado 3 h -
Humedad de procesamiento ≤0.35 % -
Temperatura de la masa 182 - 199 °C -
Temperatura del molde 82 - 93 °C -
Características
Procesamiento y forma de entrega
Moldeo por inyección
Forma de suministro
Sémola
Características especiales
Estable contra rayos U.V./interperie
Características
Copolímero
Disponibilidad regional
Norteamérica, América del Sur y Centroaméric
Demás información
Moldeo por inyección
Drying is generally not required because Celcon® and Hostaform® acetal copolymers are not hydroscopic nor are they degraded by moisture during processing. Excessive moisture can lead to splay (silver streaking) in molded parts. For better uniformity in molding especially when using regrind or material that has been stored in containers open to the atmosphere, recommended drying conditions are 80 C (180 F) for 3hours. Desiccant hopper dryers are not required. Maximum water content = 0.35%
Standard reciprocating screw injection molding machines with a high compression screw (minimum 3:1 and preferably 4:1) and low back pressure (0.35 Mpa/50 PSI) are favored. Using a low compression screw (I.E. general purpose 2:1 compression ratio) can result in unmelted particles and poor melt homogeneity. Using a high back pressure to make up for a low compression ratio may lead to excessive shear heating and deterioration of the material.

Melt Temperature: Preferred range 182-199 C (360-390 F). Melt temperature should never exceed 230 C (450 F).

Mold Surface Temperature: Preferred range 82-93 C (180-200 F) especially with wall thickness less than 1.5 mm (0.060 in.). May require mold temperature as high as 120 C (250 F) to reproduce mold surface or to assure minimal molded in stress. Wall thickness greater than 3mm (1/8 in.) may use a cooler (65 C/150 F) mold surface temperature and wall thickness over 6mm (1/4 in.) may use a cold mold surface down to 25 C (80 F). In general, mold surface temperatures lower than 82 C (180 F) may hinder weld line formation and produce a hazy surface or a surface with flow lines, pits and other included defects that can hinder part performance.
Postprocessing conditioning and moisturizing are not required. It may be necessary to fixture large or complicated parts with varying wall thickness to prevent warpage while cooling to ambient temperature.
Disclaimer
Copyright Altair Engineering GmbH. Altair Engineering GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from Altair Engineering GmbH; this is especially valid for claims of compensation resulting from consequential damages. Altair explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.
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