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This is the free Material Data Center Datasheet of Platamid® HX 2651 Pellets - PA* - ARKEMA

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Caracteristicas de procesamiento y fisicas - Propiedades térmicas
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Texto del producto
Platamid® HX 2651 Pellets
Copolyamide Hot Melt Adhesive / Extrusion Applications


Platamid® HX 2651 Pellets is a standard thermoplastic copolyamide hot melt adhesive available in pellet form.  This low melt viscosity grade is particularly suitable for manufacturing webs and nets by extrusion.
Platamid® HX 2651 Pellets offers good adhesion to various polar substrates (thermoplastics, thermosets, metal, natural fibers, etc.) thanks to its amine functionality groups.


AVAILABLE GRADES
This grade is available:
- Platamid® HX 2651 FA Pellets(undried)
PACKAGING
- Platamid® HX 2651 is delivered in 25 kg sealed bags.
SHELF LIFE
Two years from the date of delivery. For any use above this limit, please refer to our technical services.
Caracteristicas de procesamiento y fisicasSeco / CondUnidadesMétodo de ensayo
ISO Data
Indice de fluidez volumétrico, MVR 36 / * cm³/10min ISO 1133
Temperatura 130 / * °C -
Carga 2.16 / * kg -
Propiedades térmicasSeco / CondUnidadesMétodo de ensayo
ISO Data
Temperatura de fusión, 10°C/min 105 / * °C ISO 11357-1/-3
Características
Procesamiento y forma de entrega
Extrusion del film
Forma de suministro
Sémola
Características
Buenas propiedades de adhesión, Copolímero
Disponibilidad regional
Norteamérica, Europa, Asia Pacifico, América del Sur y Centroaméric, Próximo Oriente/Africa
Disclaimer
Copyright Altair Engineering GmbH. Altair Engineering GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from Altair Engineering GmbH; this is especially valid for claims of compensation resulting from consequential damages. Altair explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.
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