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This is the free Material Data Center Datasheet of CELCON® M90UV - POM - Celanese
Material Data Center offers the following functions for CELCON® M90UV:
unit conversion, PDF datasheet print, comparison with other plastics, snap fit calculation, beam deflection calculation, CAE Interfaces
unit conversion, PDF datasheet print, comparison with other plastics, snap fit calculation, beam deflection calculation, CAE Interfaces
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| Caracteristicas de procesamiento y fisicas | Valor | Unidades | Método de ensayo | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ISO Data | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Indice de fluidez volumétrico, MVR | 8 | cm³/10min | ISO 1133 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Temperatura | 190 | °C | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Carga | 2.16 | kg | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Propiedades mecánicas | Valor | Unidades | Método de ensayo | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ISO Data | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Módulo de tracción | 2600 | MPa | ISO 527 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Esfuerzo de fluencia | 65 | MPa | ISO 527 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Alarg. en límite elástico | 10 | % | ISO 527 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Resistencia al impacto Charpy c/entalla, +23°C | 6.1 | kJ/m² | ISO 179/1eA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Propiedades térmicas | Valor | Unidades | Método de ensayo | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ISO Data | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Temperatura de fusión, 10°C/min | 165 | °C | ISO 11357-1/-3 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Estabilidad al calor, 1.80 MPa | 101 | °C | ISO 75-1/-2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Coef.de expansión térmica lineal, paralelo | 110 | E-6/K | ISO 11359-1/-2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Coef.de expansión térmica lineal, normal | 120 | E-6/K | ISO 11359-1/-2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Otras propiedades | Valor | Unidades | Método de ensayo |
| Absorción de agua | 0.75 | % | Sim. to ISO 62 |
| Absorción de humedad | 0.2 | % | Sim. to ISO 62 |
| Densidad | 1410 | kg/m³ | ISO 1183 |
| Recomendación para procesamiento Moldeo por inyección | Valor | Unidades | Método de ensayo |
| Temperatura de pre-secado | 80 | °C | - |
| Tiempo de pre-secado | 3 | h | - |
| Humedad de procesamiento | ≤0.35 | % | - |
| Temperatura de la masa | 182 - 199 | °C | - |
| Temperatura del molde | 82 - 93 | °C | - |
Características
Procesamiento y forma de entrega
Moldeo por inyección
Forma de suministro
Sémola
Aditivos
Desmoldeante
Características especiales
Estable a la luz, Estable contra rayos U.V./interperie
Características
Copolímero
Disponibilidad regional
Norteamérica, América del Sur y Centroaméric
Demás información
Moldeo por inyección
Drying is generally not required because Celcon® and Hostaform® acetal copolymers are not hydroscopic nor are they degraded by moisture during processing. Excessive moisture can lead to splay (silver streaking) in molded parts. For better uniformity in molding especially when using regrind or material that has been stored in containers open to the atmosphere, recommended drying conditions are 80 C (180 F) for 3hours. Desiccant hopper dryers are not required. Maximum water content = 0.35%
Standard reciprocating screw injection molding machines with a high compression screw (minimum 3:1 and preferably 4:1) and low back pressure (0.35 Mpa/50 PSI) are favored. Using a low compression screw (I.E. general purpose 2:1 compression ratio) can result in unmelted particles and poor melt homogeneity. Using a high back pressure to make up for a low compression ratio may lead to excessive shear heating and deterioration of the material.
Melt Temperature: Preferred range 182-199 C (360-390 F). Melt temperature should never exceed 230 C (450 F).
Mold Surface Temperature: Preferred range 82-93 C (180-200 F) especially with wall thickness less than 1.5 mm (0.060 in.). May require mold temperature as high as 120 C (250 F) to reproduce mold surface or to assure minimal molded in stress. Wall thickness greater than 3mm (1/8 in.) may use a cooler (65 C/150 F) mold surface temperature and wall thickness over 6mm (1/4 in.) may use a cold mold surface down to 25 C (80 F). In general, mold surface temperatures lower than 82 C (180 F) may hinder weld line formation and produce a hazy surface or a surface with flow lines, pits and other included defects that can hinder part performance.
Postprocessing conditioning and moisturizing are not required. It may be necessary to fixture large or complicated parts with varying wall thickness to prevent warpage while cooling to ambient temperature.
Standard reciprocating screw injection molding machines with a high compression screw (minimum 3:1 and preferably 4:1) and low back pressure (0.35 Mpa/50 PSI) are favored. Using a low compression screw (I.E. general purpose 2:1 compression ratio) can result in unmelted particles and poor melt homogeneity. Using a high back pressure to make up for a low compression ratio may lead to excessive shear heating and deterioration of the material.
Melt Temperature: Preferred range 182-199 C (360-390 F). Melt temperature should never exceed 230 C (450 F).
Mold Surface Temperature: Preferred range 82-93 C (180-200 F) especially with wall thickness less than 1.5 mm (0.060 in.). May require mold temperature as high as 120 C (250 F) to reproduce mold surface or to assure minimal molded in stress. Wall thickness greater than 3mm (1/8 in.) may use a cooler (65 C/150 F) mold surface temperature and wall thickness over 6mm (1/4 in.) may use a cold mold surface down to 25 C (80 F). In general, mold surface temperatures lower than 82 C (180 F) may hinder weld line formation and produce a hazy surface or a surface with flow lines, pits and other included defects that can hinder part performance.
Postprocessing conditioning and moisturizing are not required. It may be necessary to fixture large or complicated parts with varying wall thickness to prevent warpage while cooling to ambient temperature.
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