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This is the free Material Data Center Datasheet of HOSTAFORM® C 2521 G - POM - Celanese

Material Data Center offers the following functions for HOSTAFORM® C 2521 G:
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Caracteristicas de procesamiento y fisicasValorUnidadesMétodo de ensayo
ISO Data
Indice de fluidez volumétrico, MVR 1.5 cm³/10min ISO 1133
Temperatura 190 °C -
Carga 2.16 kg -
Propiedades mecánicasValorUnidadesMétodo de ensayo
ISO Data
Módulo de tracción 2100 MPa ISO 527
Esfuerzo de fluencia 44 MPa ISO 527
Alarg. en límite elástico 12 % ISO 527
Alarg. nominal a rotura 15 % ISO 527
Resistencia al impacto Charpy, +23°C 50 kJ/m² ISO 179/1eU
Resistencia al impacto Charpy, -30°C 50 kJ/m² ISO 179/1eU
Resistencia al impacto Charpy c/entalla, +23°C 5 kJ/m² ISO 179/1eA
Resistencia al impacto Charpy c/entalla, -30°C 4.5 kJ/m² ISO 179/1eA
Propiedades térmicasValorUnidadesMétodo de ensayo
ISO Data
Temperatura de fusión, 10°C/min 165 °C ISO 11357-1/-3
Estabilidad al calor, 1.80 MPa 84 °C ISO 75-1/-2
Coef.de expansión térmica lineal, paralelo 100 E-6/K ISO 11359-1/-2
Propiedades eléctricasValorUnidadesMétodo de ensayo
ISO Data
Constante dieléctrica, 100Hz 3.8 - IEC 62631-2-1
Constante dieléctrica, 1MHz 3.8 - IEC 62631-2-1
Factor de pérdidas dieléctricas, 100Hz 20 E-4 IEC 62631-2-1
Factor de pérdidas dieléctricas, 1MHz 70 E-4 IEC 62631-2-1
Resistividad volumétrica específica 1E12 Ohm*m IEC 62631-3-1
Resistividad superficial específica 1E14 Ohm IEC 62631-3-2
Resistencia dieléctrica 35 kV/mm IEC 60243-1
Otras propiedadesValorUnidadesMétodo de ensayo
Absorción de agua 0.8 % Sim. to ISO 62
Absorción de humedad 0.2 % Sim. to ISO 62
Densidad 1340 kg/m³ ISO 1183
Recomendación para procesamiento Moldeo por inyecciónValorUnidadesMétodo de ensayo
Temperatura de pre-secado 100 - 120 °C -
Tiempo de pre-secado 3 - 6 h -
Humedad de procesamiento ≤0.2 % -
Temperatura de la masa 190 - 210 °C -
Temperatura del molde 80 - 120 °C -
Funciones
Esfuerzo-alargamiento , HOSTAFORM® C 2521 G, POM, Celanese
Módulo secante-alargamiento , HOSTAFORM® C 2521 G, POM, Celanese
Características
Procesamiento y forma de entrega
Moldeo por inyección, Extrusion del film, Extrusión de perfiles, Extrusión de láminas, Otros tipos de extrusión, Moldeo por soplado
Forma de suministro
Sémola
Aditivos
Lubricante, Desmoldeante
Características
Estabilidad térmica, Copolímero
Resistencia quimica
Resistencia alcalinica, Resistencia a solventes, Estabilidad hidrolitica, Resistencia a la oxidación
Applicaciones
Automotriz
Disponibilidad regional
Norteamérica, Europa
Demás información
Moldeo por inyección
General drying is not necessary due to low moisture absorption of
the resin.

In case of bad storage conditions (water contact or condensed water)
the use of a recirculating air dryer (100 to 120 °C / max. 40 mm
layer / 3 to 6 hours) is recommended.

Max. Water content 0,2 %
Standard injection moulding machines with three phase (15 to 25 D)
plasticating screws will fit.

Conditioning e.g. moisturizing is not necessary.
Extrusión de láminas
General drying is not necessary due to low moisture absorption of
the resin.

In case of bad storage conditions (water contact or condensed water)
the use of a recirculating air dryer (100 to 120 °C / max. 40 mm
layer / 3 to 6 hours) is recommended.

Max. Water content 0,2 %

Standard extruders with grooved feed zone and short compression
screws (minimum 25 D) will fit.

Melt temperature 180-190 °C



Conditioning e.g. moisturizing is not necessary.

In case of very thick wall thickness profiles after-annealing it is
recommended to reduce internal stress.

Annealing temperature 130-140 °C
Annealing time 10 min/mm thickness
Otros tipos de extrusión
General drying is not necessary due to low moisture absorption of
the resin.

In case of bad storage conditions (water contact or condensed water)
the use of a recirculating air dryer (100 to 120 °C / max. 40 mm
layer / 3 to 6 hours) is recommended.

Max. Water content 0,2 %

Standard extruders with grooved feed zone and short compression
screws (minimum 25 D) will fit.

Melt temperature 180-190 °C



Conditioning e.g. moisturizing is not necessary.

In case of very thick wall thickness profiles after-annealing it is
recommended to reduce internal stress.

Annealing temperature 130-140 °C
Annealing time 10 min/mm thickness
Extrusión de perfiles
General drying is not necessary due to low moisture absorption of
the resin.

In case of bad storage conditions (water contact or condensed water)
the use of a recirculating air dryer (100 to 120 °C / max. 40 mm
layer / 3 to 6 hours) is recommended.

Max. Water content 0,2 %

Standard extruders with grooved feed zone and short compression
screws (minimum 25 D) will fit.

Melt temperature 180-190 °C



Conditioning e.g. moisturizing is not necessary.

In case of very thick wall thickness profiles after-annealing it is
recommended to reduce internal stress.

Annealing temperature 130-140 °C
Annealing time 10 min/mm thickness
Extrusión de placas
General drying is not necessary due to low moisture absorption of
the resin.

In case of bad storage conditions (water contact or condensed water)
the use of a recirculating air dryer (100 to 120 °C / max. 40 mm
layer / 3 to 6 hours) is recommended.

Max. Water content 0,2 %

Standard extruders with grooved feed zone and short compression
screws (minimum 25 D) will fit.

Melt temperature 180-190 °C



Conditioning e.g. moisturizing is not necessary.

In case of very thick wall thickness profiles after-annealing it is
recommended to reduce internal stress.

Annealing temperature 130-140 °C
Annealing time 10 min/mm thickness
Disclaimer
Copyright Altair Engineering GmbH. Altair Engineering GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from Altair Engineering GmbH; this is especially valid for claims of compensation resulting from consequential damages. Altair explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.
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