Complete Set of CAMPUS® Data, ASTM Data, Biopolymer Database, Application Database, Tradename Database, Literature Database, Toolbox.

Material datasheets available free. Online registration at: www.materialdatacenter.com

Material Data Center is a leading international information system for the plastics industry. Material Data Center offers a comprehensive plastics database, calculation tools, CAE interfaces, a literature database and an application database. For more information about Material Data Center visit www.materialdatacenter.com.

This is the free Material Data Center Datasheet of VESTAMID® L-R3-MHI BK - PA12-I - Evonik Operations GmbH

Material Data Center offers the following functions for VESTAMID® L-R3-MHI BK:
unit conversion, PDF datasheet print, comparison with other plastics, snap fit calculation, beam deflection calculation, parameters for material models, CAE Interfaces

Check here, which other Vestamid datasheets, application examples or technical articles are available in Material Data Center

Use the following short links to get directly to the properties of interest in this datasheet:
Any use of this information falls under the rules of our disclaimer.
Informations produit

Plasticized, impact resistance polyamide 12 compound for injection molding

VESTAMID® L-R3-MHI BK is a medium viscosity heat and light-stabilized PA 12 compound for the injection molding process. Furthermore it is antistatic and contains a processing aid for a fast and even form filling.

VESTAMID® L-R3-MHI BK offers a good impact resistance at low temperatures. 

VESTAMID® L-R3-MHI BK is supplied as cylindrical granules, ready for processing, in moisture-proof bags.The processing temperature during the extrusion process should be within a range of 230°C to 270°C.

Pigmentation may affect values. 
 
Inside the original and undamaged packaging, the product has a shelf life of at least 2 years when stored in dry rooms at temperatures not exceeding 30°C.

For information about processing of VESTAMID®, please follow the general commendations about “Processing of VESTAMID® compounds”. 

FOR FURTHER INFORMATION PLEASE CONTACT US AT EVONIK-HP@EVONIK.COM
OR VISIT OUR PRODUCT AT  WWW.VESTAMID.COM

 

Caractéristiques des transformations/physiquessec / condUnitéNorme du test
ISO Data
Indice de fluidité à chaud en volume, MVR 10 / * cm³/10min ISO 1133
Température 275 / * °C -
Charge 5 / * kg -
Retrait au moulage, parallèle 1.4 / * % ISO 294-4, 2577
Retrait au moulage, perpendiculaire 1.6 / * % ISO 294-4, 2577
Propriétés mécaniquessec / condUnitéNorme du test
ISO Data
Module en traction 1640 / - MPa ISO 527
Contrainte d'écoulement 38 / - MPa ISO 527
Déformation au seuil d'écoulement 5 / - % ISO 527
Déformation nominale à la rupture 30 / - % ISO 527
Résistance au choc Charpy, +23°C N / - kJ/m² ISO 179/1eU
Résistance au choc Charpy, -30°C N / - kJ/m² ISO 179/1eU
Résistance au choc Charpy (entaillé), +23°C 44 / - kJ/m² ISO 179/1eA
Résistance au choc Charpy (entaillé), -30°C 15 / - kJ/m² ISO 179/1eA
Type de défaillance C / - - -
Propriétés thermiquessec / condUnitéNorme du test
ISO Data
Température de fusion, 10°C/min 178 / * °C ISO 11357-1/-3
Température de fléchissement s/chrg, 1.80 MPa 50 / * °C ISO 75-1/-2
Température de fléchissement s/chrg, 0.45 MPa 130 / * °C ISO 75-1/-2
Température de ramolliss. Vicat, B 140 / * °C ISO 306
Coeffic. de dilatation therm. linéique, parallèle 180 / * E-6/K ISO 11359-1/-2
Inflammabilité ep. nom. 1.5 mm HB / * class IEC 60695-11-10
Epaisseur de l'éprouvette 1.6 / * mm -
Propriétés électriquessec / condUnitéNorme du test
ISO Data
Résistivité transversale 6 / - Ohm*m IEC 62631-3-1
Propriétés diversessec / condUnitéNorme du test
Absorption d'eau 1.5 / * % Sim. to ISO 62
Absorption d'humidité 0.8 / * % Sim. to ISO 62
Masse volumique 1100 / - kg/m³ ISO 1183
Fonctions
Volume spécifique (pvT) , VESTAMID® L-R3-MHI BK, PA12-I, Evonik
Caractéristiques
Transformation
Moulage par injection
Conditionnement
Granulés, Noir
Additifs
Lubrifiant, Plastifiant
Propriétés spéciales
Conductivité électrique accrue, Antistatique, Modifié choc, Stabilisé à la lumière, Stabilisé à la chaleur
Disponibilité régionale
Conditions générales
Copyright Altair Engineering GmbH. Altair Engineering GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from Altair Engineering GmbH; this is especially valid for claims of compensation resulting from consequential damages. Altair explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.
Created: Source: www.materialdatacenter.com


Material Data Center is provided by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

Additional information about this material, like producer contact address, etc. can be found at www.materialdatacenter.com. For access to this extra information a registration is requested. Free online registration is available.