Complete Set of CAMPUS® Data, ASTM Data, Biopolymer Database, Application Database, Tradename Database, Literature Database, Toolbox.

Material datasheets available free. Online registration at: www.materialdatacenter.com

Material Data Center is a leading international information system for the plastics industry. Material Data Center offers a comprehensive plastics database, calculation tools, CAE interfaces, a literature database and an application database. For more information about Material Data Center visit www.materialdatacenter.com.

This is the free Material Data Center Datasheet of Badalac® ABS/PC 130 - (ABS+PC) - Bada AG

Material Data Center offers the following functions for Badalac® ABS/PC 130:
unit conversion, PDF datasheet print, comparison with other plastics, snap fit calculation, beam deflection calculation, CAE Interfaces

Check here, which other Badalac datasheets, application examples or technical articles are available in Material Data Center

Use the following short links to get directly to the properties of interest in this datasheet:
Caratteristiche Fisiche - Proprietà Meccaniche - Proprietà Termiche - Proprietà Elettriche - Altre Proprietà - Raccomandazione de Processabilità Stampaggio ad Iniezione
Any use of this information falls under the rules of our disclaimer.
Caratteristiche FisicheValoreUnitáNorma del test
ISO Data
Indice di fusione di volume, MVR 35 cm³/10min ISO 1133
Temperatura 260 °C -
Carico 5 kg -
Proprietà MeccanicheValoreUnitáNorma del test
ISO Data
Modulo a trazione 2300 MPa ISO 527
Carico unitario a trazione 55 MPa ISO 527
Deformazione a snervamento 4.8 % ISO 527
Deformazione nominale a rottura >50 % ISO 527
Resistenza alla flessione 80 MPa ISO 178
Resistenza all'urto Charpy, +23°C N kJ/m² ISO 179/1eU
Resistenza all'urto Charpy, -30°C N kJ/m² ISO 179/1eU
Resist. urto Charpy con intaglio, +23°C 45 kJ/m² ISO 179/1eA
Proprietà TermicheValoreUnitáNorma del test
ISO Data
Temp.di inflessione sotto carico, 1.80 MPa 110 °C ISO 75-1/-2
Temp.di inflessione sotto carico, 0.45 MPa 125 °C ISO 75-1/-2
Coeff.di dilatazione termica lin., parallelo 80 E-6/K ISO 11359-1/-2
Reaz. al fuoco spess.nom. 1.5mm HB class IEC 60695-11-10
Spessore provato 1.6 mm -
Proprietà ElettricheValoreUnitáNorma del test
ISO Data
Resistività volumica 1E13 Ohm*m IEC 62631-3-1
Res. Alle correnti striscianti superficiali 275 - IEC 60112
Altre ProprietàValoreUnitáNorma del test
Assorbimento d'umidità 0.2 % Sim. alla ISO 62
Massa volumica 1140 kg/m³ ISO 1183
Raccomandazione de Processabilità Stampaggio ad IniezioneValoreUnitáNorma del test
Pre-essiccamento - Temperatura 90 - 110 °C -
Pre-essiccamento - Tempo 4 h -
Umidità del Processo ≤0.02 % -
Temperatura di fusione 240 - 270 °C -
Temperatura dello stampo 70 - 90 °C -
Caratteristiche
Processabilità e Forma di Forni
Stampaggio ad Iniezione
Caratteristiche speciali
Alto urto o modificato all'urto
Disponibilità geografica
Nord America, Europa, Asia Oceano Pacifico, South and Central America, Near East/Africa
Disclaimer
Copyright Altair Engineering GmbH. Altair Engineering GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from Altair Engineering GmbH; this is especially valid for claims of compensation resulting from consequential damages. Altair explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.
Created: Source: www.materialdatacenter.com


Material Data Center is provided by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

Additional information about this material, like producer contact address, etc. can be found at www.materialdatacenter.com. For access to this extra information a registration is requested. Free online registration is available.