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This is the free Material Data Center Datasheet of CELCON® M25UV - POM - Celanese

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Caratteristiche FisicheValoreUnitáNorma del test
ISO Data
Indice di fusione di volume, MVR 2.2 cm³/10min ISO 1133
Temperatura 190 °C -
Carico 2.16 kg -
Ritiro di stampaggio, parallelo 2.2 % ISO 294-4, 2577
Ritiro di stampaggio, perpendicolare 1.8 % ISO 294-4, 2577
Proprietà MeccanicheValoreUnitáNorma del test
ISO Data
Modulo a trazione 2500 MPa ISO 527
Carico unitario a trazione 62 MPa ISO 527
Deformazione a snervamento 12 % ISO 527
Resistenzia all'urto Charpy con intaglio, +23°C 8.5 kJ/m² ISO 179/1eA
Proprietà TermicheValoreUnitáNorma del test
ISO Data
Temperatura di fusione, 10°C/min 166 °C ISO 11357-1/-3
Temp.di inflessione sotto carico, 1.80 MPa 93 °C ISO 75-1/-2
Coeff.di dilatazione termica lin., parallelo 120 E-6/K ISO 11359-1/-2
Coeff.di dilatazione termica lin., perpend. 120 E-6/K ISO 11359-1/-2
Altre ProprietàValoreUnitáNorma del test
Assorbimento d'acqua 0.75 % Sim. alla ISO 62
Assorbimento d'umidità 0.2 % Sim. alla ISO 62
Massa volumica 1410 kg/m³ ISO 1183
Raccomandazione de Processabilità Stampaggio ad IniezioneValoreUnitáNorma del test
Pre-essiccamento - Temperatura 80 °C -
Pre-essiccamento - Tempo 3 h -
Umidità del Processo ≤0.35 % -
Temperatura di fusione 182 - 199 °C -
Temperatura dello stampo 82 - 93 °C -
Caratteristiche
Processabilità e Forma di Forni
Stampaggio ad Iniezione
Forma fisica disponibile
Pellet
Caratteristiche speciali
Estab. agli U.V. o per applicaz.in esterni
Caratteristiche
Copolimero
Disponibilità geografica
Nord America, South and Central America
Altre informazioni
Stampaggio ad Iniezione
Drying is generally not required because Celcon® and Hostaform® acetal copolymers are not hydroscopic nor are they degraded by moisture during processing. Excessive moisture can lead to splay (silver streaking) in molded parts. For better uniformity in molding especially when using regrind or material that has been stored in containers open to the atmosphere, recommended drying conditions are 80 C (180 F) for 3hours. Desiccant hopper dryers are not required. Maximum water content = 0.35%
Standard reciprocating screw injection molding machines with a high compression screw (minimum 3:1 and preferably 4:1) and low back pressure (0.35 Mpa/50 PSI) are favored. Using a low compression screw (I.E. general purpose 2:1 compression ratio) can result in unmelted particles and poor melt homogeneity. Using a high back pressure to make up for a low compression ratio may lead to excessive shear heating and deterioration of the material.

Melt Temperature: Preferred range 182-199 C (360-390 F). Melt temperature should never exceed 230 C (450 F).

Mold Surface Temperature: Preferred range 82-93 C (180-200 F) especially with wall thickness less than 1.5 mm (0.060 in.). May require mold temperature as high as 120 C (250 F) to reproduce mold surface or to assure minimal molded in stress. Wall thickness greater than 3mm (1/8 in.) may use a cooler (65 C/150 F) mold surface temperature and wall thickness over 6mm (1/4 in.) may use a cold mold surface down to 25 C (80 F). In general, mold surface temperatures lower than 82 C (180 F) may hinder weld line formation and produce a hazy surface or a surface with flow lines, pits and other included defects that can hinder part performance.
Postprocessing conditioning and moisturizing are not required. It may be necessary to fixture large or complicated parts with varying wall thickness to prevent warpage while cooling to ambient temperature.
Disclaimer
Copyright Altair Engineering GmbH. Altair Engineering GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from Altair Engineering GmbH; this is especially valid for claims of compensation resulting from consequential damages. Altair explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.
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