Complete Set of CAMPUS® Data, ASTM Data, Biopolymer Database, Application Database, Tradename Database, Literature Database, Toolbox.

Material datasheets available free. Online registration at: www.materialdatacenter.com

Material Data Center is a leading international information system for the plastics industry. Material Data Center offers a comprehensive plastics database, calculation tools, CAE interfaces, a literature database and an application database. For more information about Material Data Center visit www.materialdatacenter.com.

This is the free Material Data Center Datasheet of KEPITAL® FM2520S - POM-Z - Korea Engineering Plastics Co. Ltd.

Material Data Center offers the following functions for KEPITAL® FM2520S:
unit conversion, PDF datasheet print, comparison with other plastics

Check here, which other Kepital datasheets, application examples or technical articles are available in Material Data Center

Use the following short links to get directly to the properties of interest in this datasheet:
Caratteristiche Fisiche - Proprietà Meccaniche - Proprietà Termiche - Proprietà Elettriche - Altre Proprietà - Raccomandazione de Processabilità Stampaggio ad Iniezione
Any use of this information falls under the rules of our disclaimer.
Caratteristiche FisicheValoreUnitáNorma del test
ISO Data
Indice di Fluiditá, MFI 10.5 g/10min ISO 1133
Ritiro di stampaggio, parallelo 2.0 % ISO 294-4, 2577
ASTM Data
Indice di fluidità a caldo, MFI 9 g/10min ASTM D 1238
Ritiro di stampaggio, parallelo 0.02 mm/mm ASTM D 955
Proprietà MeccanicheValoreUnitáNorma del test
ISO Data
Resistenza a trazione 58 MPa ISO 527
Deformazione a snervamento 10 % ISO 527
Deformazione a rottura 33 % ISO 527
Modulo a flessione, 23°C 2400 MPa ISO 178
Resist. urto Charpy con intaglio, +23°C 5.5 kJ/m² ISO 179/1eA
Proprietà TermicheValoreUnitáNorma del test
ISO Data
Temperatura di fusione, 10°C/min 165 °C ISO 11357-1/-3
Temp.di inflessione sotto carico, 1.80 MPa 89 °C ISO 75-1/-2
Coeff.di dilatazione termica lin., parallelo 130 E-6/K ISO 11359-1/-2
Reazione al fuoco a spessore h HB class IEC 60695-11-10
Proprietà ElettricheValoreUnitáNorma del test
ISO Data
Resistività superficiale >1E15 Ohm IEC 62631-3-2
Altre ProprietàValoreUnitáNorma del test
Assorbimento d'acqua 0.2 % Sim. alla ISO 62
Massa volumica 1380 kg/m³ ISO 1183
Densità 1400 kg/m³ ASTM D 792
Raccomandazione de Processabilità Stampaggio ad IniezioneValoreUnitáNorma del test
Pre-essiccamento - Temperatura 80 - 100 °C -
Pre-essiccamento - Tempo 3 - 4 h -
Umidità del Processo ≤0.1 % -
Temperatura dello stampo 60 - 80 °C -
Temperatura - Zona di Alimentazione 60 - 80 °C -
Zona 1 170 - 180 °C -
Zona 2 180 - 190 °C -
Zona 3 190 - 200 °C -
Temperatura dell ugello 180 - 210 °C -
Contropressione 2 MPa -
Caratteristiche
Processabilità e Forma di Forni
Stampaggio ad Iniezione
Caratteristiche
Elevato coefficiente di attrito, Copolimero
Disponibilità geografica
Nord America, Europa, Asia Oceano Pacifico
Disclaimer
Copyright Altair Engineering GmbH. Altair Engineering GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from Altair Engineering GmbH; this is especially valid for claims of compensation resulting from consequential damages. Altair explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.
Created: Source: www.materialdatacenter.com


Material Data Center is provided by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

Additional information about this material, like producer contact address, etc. can be found at www.materialdatacenter.com. For access to this extra information a registration is requested. Free online registration is available.