Complete Set of CAMPUS® Data, ASTM Data, Biopolymer Database, Application Database, Tradename Database, Literature Database, Toolbox.

Material datasheets available free. Online registration at: www.materialdatacenter.com

Material Data Center is a leading international information system for the plastics industry. Material Data Center offers a comprehensive plastics database, calculation tools, CAE interfaces, a literature database and an application database. For more information about Material Data Center visit www.materialdatacenter.com.

This is the free Material Data Center Datasheet of VESTAMID® L1833 BK 9.7623 - PA12-GF23 - Evonik Operations GmbH

Material Data Center offers the following functions for VESTAMID® L1833 BK 9.7623:
unit conversion, PDF datasheet print, comparison with other plastics, snap fit calculation, beam deflection calculation, CAE Interfaces

Check here, which other Vestamid datasheets, application examples or technical articles are available in Material Data Center

Use the following short links to get directly to the properties of interest in this datasheet:
Any use of this information falls under the rules of our disclaimer.
商品の説明文
Glass fiber-reinforced, easily demoldable and heat-stabilized polyamide 12 compound

VESTAMID® L1833 BK 9.7623 is a 23% glass fiber-reinforced, easily demoldable and heat-stabilized polyamide 12 compound.

Due to its mold release properties, VESTAMID®  L1833 BK 9.7623 is suitable for the efficient production of injection molded parts with short cycle times.

VESTAMID® L1833 BK 9.7623 is supplied as cylindrical granules, ready for processing, in moisture-proof bags.

Pigmentation may affect values.

Inside the original and undamaged packaging, the product has a shelf life of at least 2 years when stored in dry rooms at temperatures not exceeding 30°C.

For information about processing of VESTAMID®, please follow the general commendations about “Processing of VESTAMID® compounds”. 

FOR FURTHER INFORMATION PLEASE CONTACT US AT EVONIK-HP@EVONIK.COM
OR VISIT OUR PRODUCT AT  WWW.VESTAMID.COM
Processing/Physical Characteristics乾燥/調湿単位テスト基準
ISO データ
メルトボリュームレイト, MVR 41 / * cm³/10min ISO 1133
温度 275 / * °C -
荷重 5 / * kg -
成形収縮率, 平行 0.3 / * % ISO 294-4, 2577
成形収縮率, 直角 0.6 / * % ISO 294-4, 2577
機械的特性乾燥/調湿単位テスト基準
ISO データ
引張弾性率 5500 / 4650 MPa ISO 527
降伏応力 106 / 100 MPa ISO 527
降伏ひずみ 4 / 5 % ISO 527
破壊呼びひずみ 7 / 7 % ISO 527
シャルピー衝撃強さ, +23°C 90 / 81 kJ/m² ISO 179/1eU
Type of failure C / C - -
シャルピー衝撃強さ, -30°C 95 / 83 kJ/m² ISO 179/1eU
Type of failure C / C - -
ノッチ付きシャルピー衝撃強さ, +23°C 25 / 18 kJ/m² ISO 179/1eA
Type of failure C / C - -
ノッチ付きシャルピー衝撃強さ, -30°C 16 / 13 kJ/m² ISO 179/1eA
Type of failure C / C - -
熱的特性乾燥/調湿単位テスト基準
ISO データ
溶融温度, 10°C/min 178 / * °C ISO 11357-1/-3
ガラス転移点, 10°C/min 40 / * °C ISO 11357-1/-2
荷重たわみ温度, 1.80 MPa 160 / * °C ISO 75-1/-2
荷重たわみ温度, 0.45 MPa 175 / * °C ISO 75-1/-2
ビカット軟化温度, B 175 / * °C ISO 306
線膨張係数, 平行 70 / * E-6/K ISO 11359-1/-2
1.5mm厚さでの燃焼性 HB / * class IEC 60695-11-10
試験片の厚さ 1.6 / * mm -
電気的特性.乾燥/調湿単位テスト基準
ISO データ
比誘電率, 100Hz 2.6 / - - IEC 62631-2-1
比誘電率, 1MHz 2.3 / - - IEC 62631-2-1
誘電正接, 1MHz 158 / - E-4 IEC 62631-2-1
体積抵抗率 1E13 / 2.3E12 Ohm*m IEC 62631-3-1
耐電圧 - / 49 kV/mm IEC 60243-1
耐トラッキング性 600 / - - IEC 60112
その他の特性.乾燥/調湿単位テスト基準
吸水率 1.2 / * % Sim. to ISO 62
吸湿率 0.6 / * % Sim. to ISO 62
密度 1170 / - kg/m³ ISO 1183
特殊な特性
成形加工法.
射出成形.
納入形状.
ペレット., 黒
添加剤.
離型剤.
特殊な特性.
熱安定化.
領域別の利用可能性
Disclaimer
Copyright Altair Engineering GmbH. Altair Engineering GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from Altair Engineering GmbH; this is especially valid for claims of compensation resulting from consequential damages. Altair explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.
Created: Source: www.materialdatacenter.com


Material Data Center is provided by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

Additional information about this material, like producer contact address, etc. can be found at www.materialdatacenter.com. For access to this extra information a registration is requested. Free online registration is available.