Complete Set of CAMPUS® Data, ASTM Data, Biopolymer Database, Application Database, Tradename Database, Literature Database, Toolbox.

Material datasheets available free. Online registration at: www.materialdatacenter.com

Material Data Center is a leading international information system for the plastics industry. Material Data Center offers a comprehensive plastics database, calculation tools, CAE interfaces, a literature database and an application database. For more information about Material Data Center visit www.materialdatacenter.com.

This is the free Material Data Center Datasheet of Rilsan® BESNO TL - PA11 - ARKEMA

Material Data Center offers the following functions for Rilsan® BESNO TL:
unit conversion, PDF datasheet print, parameters for material models, CAE Interfaces

Check here, which other Rilsan datasheets, application examples or technical articles are available in Material Data Center

Use the following short links to get directly to the properties of interest in this datasheet:
Any use of this information falls under the rules of our disclaimer.
商品の説明文
PA11,EHL,22-010
Rilsan® BESNO TL resin is a polyamide 11 produced from a renewable source. This natural grade is designed for extrusion.



Main applications:
  • Fluid transportation


Packaging:

This grade is delivered dried in sealed packaging (25 kg bags, 44 lb bags, 1000 lb rigid containers) ready to be processed.

Shelf Life:
Two years from the delivery. For any use above this limit, please refer to our technical services.
Processing/Physical Characteristics乾燥/調湿単位テスト基準
ISO データ
メルトボリュームレイト, MVR 1 / * cm³/10min ISO 1133
温度 235 / * °C -
荷重 2.16 / * kg -
機械的特性乾燥/調湿単位テスト基準
ISO データ
引張弾性率 - / 1280 MPa ISO 527
降伏応力 - / 38 MPa ISO 527
降伏ひずみ - / 5 % ISO 527
破壊呼びひずみ - / >50 % ISO 527
ノッチ付きシャルピー衝撃強さ, +23°C - / 11 kJ/m² ISO 179/1eA
ノッチ付きシャルピー衝撃強さ, -30°C - / 12 kJ/m² ISO 179/1eA
パンクチャー衝撃-最大応力, -30°C - / 6000 N ISO 6603-2
パンクチャー衝撃エネルギー, -30゚C - / 70 J ISO 6603-2
ショア硬さD 72 / * - ISO 7619-1
熱的特性乾燥/調湿単位テスト基準
ISO データ
溶融温度, 10°C/min 186 / * °C ISO 11357-1/-3
荷重たわみ温度, 1.80 MPa 50 / * °C ISO 75-1/-2
荷重たわみ温度, 0.45 MPa 145 / * °C ISO 75-1/-2
ビカット軟化温度, B 160 / * °C ISO 306
線膨張係数, 平行 85 / * E-6/K ISO 11359-1/-2
1.5mm厚さでの燃焼性 HB / * class IEC 60695-11-10
試験片の厚さ 1.6 / * mm -
Yellow Card 可用 はい / * - -
電気的特性.乾燥/調湿単位テスト基準
ISO データ
比誘電率, 100Hz 3 / - - IEC 62631-2-1
比誘電率, 1MHz 3 / - - IEC 62631-2-1
誘電正接, 100Hz 308 / - E-4 IEC 62631-2-1
誘電正接, 1MHz 183 / - E-4 IEC 62631-2-1
体積抵抗率 - / 1E12 Ohm*m IEC 62631-3-1
表面抵抗率 * / 1E14 Ohm IEC 62631-3-2
耐電圧 - / 30 kV/mm IEC 60243-1
その他の特性.乾燥/調湿単位テスト基準
吸水率 1.9 / * % Sim. to ISO 62
密度 1020 / 1020 kg/m³ ISO 1183
Biobased content 96 % -
機能
 粘度せん断速度. , Rilsan® BESNO TL, PA11, ARKEMA
 せん断応力-せん断速度. , Rilsan® BESNO TL, PA11, ARKEMA
 せん断弾性率-温度. , Rilsan® BESNO TL (乾燥), PA11, ARKEMA
 応力-ひずみ. , Rilsan® BESNO TL (乾燥), PA11, ARKEMA
 割線弾性率−ひずみ. , Rilsan® BESNO TL (乾燥), PA11, ARKEMA
 応力-ひずみ (等時的). 23°C, Rilsan® BESNO TL (乾燥), PA11, ARKEMA
 クリープ弾性率−時間. 23°C, Rilsan® BESNO TL (乾燥), PA11, ARKEMA
クリープ曲線 23°C, Rilsan® BESNO TL (乾燥), PA11, ARKEMA
 応力-ひずみ (等時的). 80°C, Rilsan® BESNO TL (乾燥), PA11, ARKEMA
 クリープ弾性率−時間. 80°C, Rilsan® BESNO TL (乾燥), PA11, ARKEMA
クリープ曲線 80°C, Rilsan® BESNO TL (乾燥), PA11, ARKEMA
特殊な特性
成形加工法.
射出成形., フィルム押出成形., 異形押出成形., シート押出成形., その他の押出成形.
納入形状.
ペレット.
添加剤.
滑剤.
特殊な特性.
光安定化., 紫外線安定化., 熱安定化.
Certifications
Contains renewable resources
領域別の利用可能性
その他の情報
その他の押出成形.

Processing conditions:

- Typical melt temperature (Min / Recommended / Max) : 230°C / 250°C / 280°C.

- Drying time and temperature (only necessary for bags opened for more than two hours) : 4-8 hours at 80-90°C.
Disclaimer
Copyright Altair Engineering GmbH. Altair Engineering GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from Altair Engineering GmbH; this is especially valid for claims of compensation resulting from consequential damages. Altair explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.
Created: Source: www.materialdatacenter.com


Material Data Center is provided by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

Additional information about this material, like producer contact address, etc. can be found at www.materialdatacenter.com. For access to this extra information a registration is requested. Free online registration is available.