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This is the free Material Data Center Datasheet of K-Resin® KR21 - SB - INEOS Styrolution

Material Data Center offers the following functions for K-Resin® KR21:
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제품 설명서
K-Resin KR21 is mainly used for Styrenic polymers modification to enhance the impact properties and Environmental Stress Cracking Resistance (ESCR).
Applications: Reinforcement of Recycled ABS and HIPS.
Processing/Physical Characteristics단위시험규격
ISO 데이터
용융 부피 - 흐름 속도, MVR 6 cm³/10min ISO 1133
온도 200 °C -
하중 5 kg -
성형 수축률, 평행 0.7 % ISO 294-4, 2577
기계적 특성단위시험규격
ISO 데이터
인장탄성률 120 MPa ISO 527
파단시 강도 15 MPa ISO 527
파단시 신율 500 % ISO 527
굴곡 계수, 23°C 100 MPa ISO 178
굴곡 강도 3 MPa ISO 178
챠피 충격 강도, +23°C N kJ/m² ISO 179/1eU
챠피 노치드 충격 강도, +23°C N kJ/m² ISO 179/1eA
아이조드 충격은 노치, +23°C N kJ/m² ISO 180/1A
쇼어 D 경도 40 - ISO 7619-1
열적 특성단위시험규격
ISO 데이터
하중하에서의 변형온도, 0.45 MPa 40[ann.] °C ISO 75-1/-2
비카트 연화 온도, A 48 °C ISO 306
ann.: annealed
광학 특성단위시험규격
ASTM 데이터
탁도 5 % ASTM D 1003
광선 투겠淅 89 % ASTM D 1003
Other Standards[S]
굴절 지수 1.56 - ISO 489
S: These properties are reported by the producer according standards that are different to our defaults.
기타 특성단위시험규격
조건에서의 흡습성 0.07 % ISO 62와 유사
밀도 990 kg/m³ ISO 1183
Processing Recommendation Injection Molding단위시험규격
용융수지온도 180 - 220 °C -
성형온도 30 - 50 °C -
특징
생산 공정
사출 성형
인도 유형
펠렛 (입자,알갱이)
특별 특성
고충격 또는 고충격 보강
특성
Copolymer
내화학성에
Environmental Stress Crack Resistance
지역별 검색
쨘횕쩐횈쨍횧쨍짰횆짬, 짱쨌쨈, 쩐횈쩍횄쩐횈 횇횂횈챵쩐챌 횁철쩔짧, 쨀짼쨘횓 쨔횞 횁횩쩐횙 쩐횈쨍횧쨍짰횆짬, 쨉쩔쩐챌 쨔횞 쩐횈횉횁쨍짰횆짬 짹횢쩔짧
Disclaimer
Copyright Altair Engineering GmbH. Altair Engineering GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from Altair Engineering GmbH; this is especially valid for claims of compensation resulting from consequential damages. Altair explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.
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