Complete Set of CAMPUS® Data, ASTM Data, Biopolymer Database, Application Database, Tradename Database, Literature Database, Toolbox.

Material datasheets available free. Online registration at: www.materialdatacenter.com

Material Data Center is a leading international information system for the plastics industry. Material Data Center offers a comprehensive plastics database, calculation tools, CAE interfaces, a literature database and an application database. For more information about Material Data Center visit www.materialdatacenter.com.

This is the free Material Data Center Datasheet of VESTAMID® L-R7-MHI BK - PA12-I - Evonik Operations GmbH

Material Data Center offers the following functions for VESTAMID® L-R7-MHI BK:
unit conversion, PDF datasheet print, comparison with other plastics, snap fit calculation, beam deflection calculation, CAE Interfaces

Check here, which other Vestamid datasheets, application examples or technical articles are available in Material Data Center

Use the following short links to get directly to the properties of interest in this datasheet:
Any use of this information falls under the rules of our disclaimer.
제품 설명서

Medium-viscosity, permanently antistatic PA12 resin with enhanced strength

VESTAMID® L-R7-MHI BK is a medium viscosity, permanently antistatic PA12 resin with enhanced strength, especially at low temperatures. Furthermore it is antistatic and contains a processing aid for a fast and even form filling.

The electrical resistance properties which can be achieved on the moulding depend on the processing conditions.

VESTAMID® L-R7-MHI BK is supplied as cylindrical granules, ready for processing, in moisture-proof bags.The processing temperature during the extrusion process should be within a range of 230°C to 270°C.

Pigmentation may affect values.

Inside the original and undamaged packaging, the product has a shelf life of at least 2 years when stored in dry rooms at temperatures not exceeding 30°C.

For information about processing of VESTAMID®, please follow the general commendations about “Processing of VESTAMID® compounds”. 

FOR FURTHER INFORMATION PLEASE CONTACT US AT EVONIK-HP@EVONIK.COM
OR VISIT OUR PRODUCT AT  WWW.VESTAMID.COM

Processing/Physical Characteristics건조/응축단위시험규격
ISO 데이터
용융 부피 - 흐름 속도, MVR 16 / * cm³/10min ISO 1133
온도 275 / * °C -
하중 5 / * kg -
성형 수축률, 평행 1.4 / * % ISO 294-4, 2577
성형 수축률, 수직 1.4 / * % ISO 294-4, 2577
기계적 특성건조/응축단위시험규격
ISO 데이터
인장탄성률 1480 / 1200 MPa ISO 527
항복강도 36 / 34 MPa ISO 527
항복변형률 6 / 10 % ISO 527
파단시 평균신율 33 / >50 % ISO 527
챠피 충격 강도 , +23°C N / N kJ/m² ISO 179/1eU
챠피 충격 강도, -30°C N / N kJ/m² ISO 179/1eU
챠피 노치드 충격 강도, +23°C 43 / 34 kJ/m² ISO 179/1eA
Type of failure - / C - -
챠피 노치드 충격 강도, -30°C 12 / 8 kJ/m² ISO 179/1eA
Type of failure C / C - -
열적 특성건조/응축단위시험규격
ISO 데이터
녹는점, 10°C/min 178 / * °C ISO 11357-1/-3
하중하에서의 변형온도, 1.80 MPa 50 / * °C ISO 75-1/-2
하중하에서의 변형온도, 0.45 MPa 130 / * °C ISO 75-1/-2
비카트 연화 온도, B 140 / * °C ISO 306
선형 열팽창 계수, 평행 170 / * E-6/K ISO 11359-1/-2
1.5mm 평균두께에서의 난연성 HB / * class IEC 60695-11-10
테스트 두께 1.5 / * mm -
Yellow Card 유효한 예 / * - -
두께 H인 제품의 난연성 HB / * class IEC 60695-11-10
테스트 두께 0.8 / * mm -
Yellow Card 유효한 예 / * - -
전기적 특성건조/응축단위시험규격
ISO 데이터
부피 저항 4.75E7 / - Ohm*m IEC 62631-3-1
기타 특성건조/응축단위시험규격
물에서의 흡수성 1.5 / * % ISO 62와 유사
조건에서의 흡습성 0.7 / * % ISO 62와 유사
밀도 1080 / 1080 kg/m³ ISO 1183
특징
생산 공정
사출 성형
인도 유형
펠렛 (입자,알갱이), 검정
부가물
윤활제, 이형제
특별 특성
증가된 전기전도성, 정전기 방지, 고충격 또는 고충격 보강, 가시광선 안정성, 열안정성
지역별 검색
Disclaimer
Copyright Altair Engineering GmbH. Altair Engineering GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from Altair Engineering GmbH; this is especially valid for claims of compensation resulting from consequential damages. Altair explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.
Created: Source: www.materialdatacenter.com


Material Data Center is provided by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

Additional information about this material, like producer contact address, etc. can be found at www.materialdatacenter.com. For access to this extra information a registration is requested. Free online registration is available.