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This is the free Material Data Center Datasheet of Kocetal® UR304 - (POM+TPU) - Kolon Industries

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加工/物理特性 - 机械性能 - 热性能 - 电性能 - 其它性能 - 加工推荐（注塑）
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加工/物理特性价值单位Test Standard
ISO数据
熔融指数, MFI 7.5 g/10min ISO 1133
温度 190 °C -
负载 2.16 kg -
模塑收缩率, 平行 1.7 % ISO 294-4, 2577
ASTM数据
熔融指数, MFI 12 g/10min ASTM D 1238
温度 190 °C -
负载 2.16 kg -
模压收缩率, 平行 0.017 mm/mm ASTM D 955
机械性能价值单位Test Standard
ISO数据
拉伸强度 45 MPa ISO 527
断裂伸长率 >50 % ISO 527
弯曲模量, 23°C 1900 MPa ISO 178
简支梁缺口冲击强度, +23°C 13 kJ/m² ISO 179/1eA
洛克硬度 M 76 - ISO 2039-2
ASTM数据
拉伸强度 45 MPa ASTM D 638
断裂伸长率 140 % ASTM D 638
弯曲模量 1800 MPa ASTM D 790
弯曲强度 60 MPa ASTM D 790
洛克硬度 M 76 - ASTM D 785
悬臂梁缺口冲击强度, 1/8 in 130 J/m ASTM D 256
热性能价值单位Test Standard
ISO数据
熔融温度, 10°C/min 166 °C ISO 11357-1/-3
热变形温度, 1.80 MPa 72 °C ISO 75-1/-2
ASTM数据
UL94 燃烧性 HB - UL 94
测试厚度 0.8 mm -
热释放速率, 平行 130 E-6/K ASTM D 696
DTUL @ 66 psi 145 °C ASTM D 648
DTUL @ 264 psi 82 °C ASTM D 648
熔点 166 °C ASTM D 3418
电性能价值单位Test Standard
ISO数据
体积电阻率 1E12 Ohm*m IEC 62631-3-1
表面电阻率 >1E15 Ohm IEC 62631-3-2
介电强度 19 kV/mm IEC 60243-1
ASTM数据
电介质强度, 短时 19 kV/mm ASTM D 149
耗散因素, 1 MHz 0.006 - ASTM D 150
表面电阻率 >1E15 Ohm ASTM D 257
体积电阻率 1E14 Ohm*cm ASTM D 257
其它性能价值单位Test Standard
密度 1360 kg/m³ ISO 1183
吸水率, 24小时 0.25 % ASTM D 570
密度 1360 kg/m³ ASTM D 792
加工推荐（注塑）价值单位Test Standard
预干燥-温度 80 - 90 °C -
预干燥-时间 3 h -
注塑熔体温度 ≤220 °C -
模具温度 60 - 80 °C -
1区 180 °C -
2区 190 °C -
3区 190 °C -
喷嘴温度 200 °C -
典型数据
加工方法
注塑
特殊性能
高冲击韧性的/经抗冲改性的
地区供应
北美, 亚太
权利义务的法律声明
Copyright Altair Engineering GmbH. Altair Engineering GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from Altair Engineering GmbH; this is especially valid for claims of compensation resulting from consequential damages. Altair explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.
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