Complete Set of CAMPUS® Data, ASTM Data, Biopolymer Database, Application Database, Tradename Database, Literature Database, Toolbox.

Material datasheets available free. Online registration at: www.materialdatacenter.com

Material Data Center is a leading international information system for the plastics industry. Material Data Center offers a comprehensive plastics database, calculation tools, CAE interfaces, a literature database and an application database. For more information about Material Data Center visit www.materialdatacenter.com.

This is the free Material Data Center Datasheet of VESTAMID® E62-S1 - TPA - Evonik Operations GmbH

Material Data Center offers the following functions for VESTAMID® E62-S1:
unit conversion, PDF datasheet print, comparison with other plastics, snap fit calculation, beam deflection calculation, CAE Interfaces

Check here, which other Vestamid datasheets, application examples or technical articles are available in Material Data Center

Use the following short links to get directly to the properties of interest in this datasheet:
加工/物理特性 - 机械性能 - 热性能 - 电性能 - 其它性能
Any use of this information falls under the rules of our disclaimer.
材料文字说明
Heat-stabilized compound based on polyamide 12 elastomer for molding of sport shoe soles

VESTAMID® E62-S1 is a PA 12 elastomer consisting of PA 12 segments and softening segments. The material is free of volatile or migrating plasticizer.

The VESTAMID® E represent thermoplastic elastomers generically characterized as polyether block copolyamides (PEBA) consisting of PA 12 and polyether segments.

VESTAMID® E62-S1 is especially developed for sport shoe soles. It has good impact strength at low temperatures.

VESTAMID® E62-S1 is supplied as cylindrical pellets in moisture-proof packaging, ready for processing.
 
The process temperatures should be within a range of 190°C – 230°C.

Pigmentation may affect values.

Inside the original and undamaged packaging, the product has a shelf life of at least 2 years when stored in dry rooms at temperatures not exceeding 30°C.

For information about processing of VESTAMID®, please follow the general commendations about “Processing of VESTAMID® compounds”. 

FOR FURTHER INFORMATION PLEASE CONTACT US AT EVONIK-HP@EVONIK.COM
OR VISIT OUR PRODUCT AT  WWW.VESTAMID.COM
加工/物理特性干 / 已调节单位Test Standard
ISO数据
熔体体积流动速度, MVR 20 / * cm³/10min ISO 1133
温度 240 / * °C -
载荷 2.16 / * kg -
模塑收缩率, 平行 0.8 / * % ISO 294-4, 2577
模塑收缩率, 垂直 1.4 / * % ISO 294-4, 2577
机械性能干 / 已调节单位Test Standard
ISO数据
拉伸模量 389 / - MPa ISO 527
屈服应力 23 / - MPa ISO 527
屈服伸长率 32 / - % ISO 527
名义断裂伸长率 >50 / - % ISO 527
无缺口简支梁冲击强度, +23°C N / - kJ/m² ISO 179/1eU
简支梁冲击强度, -30°C N / - kJ/m² ISO 179/1eU
简支梁缺口冲击强度, +23°C 121 / - kJ/m² ISO 179/1eA
简支梁缺口冲击强度, -30°C 8 / - kJ/m² ISO 179/1eA
Type of failure C / - - -
肖氏硬度D 61 / * - ISO 7619-1
热性能干 / 已调节单位Test Standard
ISO数据
熔融温度, 10°C/min 172 / * °C ISO 11357-1/-3
玻璃化转变温度, 10°C/min 10 / * °C ISO 11357-1/-2
热变形温度, 1.80 MPa 45 / * °C ISO 75-1/-2
热变形温度, 0.45 MPa 100 / * °C ISO 75-1/-2
维卡软化温度, B 110 / * °C ISO 306
电性能干 / 已调节单位Test Standard
ISO数据
相对介电常数., 100Hz 9 / - - IEC 62631-2-1
相对介电常数., 1MHz 4 / - - IEC 62631-2-1
介质损耗因子, 100Hz 1000 / - E-4 IEC 62631-2-1
介质损耗因子, 1MHz 1200 / - E-4 IEC 62631-2-1
体积电阻率 2E10 / 2.5E9 Ohm*m IEC 62631-3-1
其它性能干 / 已调节单位Test Standard
吸水性 1.1 / * % 类似ISO 62
吸湿性 0.5 / * % 类似ISO 62
密度 1030 / - kg/m³ ISO 1183
典型数据
加工方法
注塑
供货形式
粒料
特殊性能
经热稳处理的/耐热的
应用
运动器械
地区供应
北美, 欧洲, 亚太, 中南美洲, 中东/非洲
权利义务的法律声明
Copyright Altair Engineering GmbH. Altair Engineering GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from Altair Engineering GmbH; this is especially valid for claims of compensation resulting from consequential damages. Altair explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.
Created: Source: www.materialdatacenter.com


Material Data Center is provided by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

Additional information about this material, like producer contact address, etc. can be found at www.materialdatacenter.com. For access to this extra information a registration is requested. Free online registration is available.