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Reny - PA - Mitsubishi Engineering-Plastics Corporation
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...he thickness of the metallization. An alternative to this is to use heat-conducting substrates. In the meantime, various materials, e. g. Tecacomp LDS 4109, a black polyphthalamide (PPA) from Ensinger GmbH, Nufringen, Germany, or Reny L455, a polyarylamide PA-MXD6 from Mitsubishi Engineering Plastics Corp., in white, have become available for manufacturing laser-structured MID components. The important aspect here is that the adhesion of the metallization not be reduced despite the fillers (e. g...
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